01
Epoxy resin
Forms the thermoset matrix around the device and interconnects.
← Carnauba wax emulsions
Semiconductor materials · Application development
Carnauba release chemistry for epoxy molding compounds.
A US second-source development path for EMC formulators who need a documented candidate—not a universal drop-in claim. We start with your incumbent material, compound system and qualification limits.
01
Internal release
A formulation input evaluated inside the complete EMC system.
02
External release
A separate mold or chase treatment with a different process route.
03
Ionics
Limits and extraction methods come from the customer specification.
04
Qualification
Moldability and package reliability must be proven in the final process.
Application context
Release is one variable in a tightly coupled system.
Semiconductor EMC combines resin, cure chemistry, a high mineral-filler fraction and a controlled additive package. The release chemistry must help the cured package leave the tool without creating a new problem at the package surface or interface.
02
Curing system
Phenolic or other specified hardener plus the selected accelerator or catalyst.
03
Inorganic filler
Usually silica-rich in published EMC systems; loading and particle distribution govern flow and package behavior.
04
Interface package
Coupling and adhesion chemistry manages bonding to lead frames, laminates, die surfaces and passivation.
05
Release package
Wax or another release chemistry balances mold release against flow, fouling, adhesion and package appearance.
Published EMC formulations demonstrate carnauba as one possible release ingredient, not a universal solution. Comparative research also shows wax choice can change flow, water absorption, glass-transition behavior and molded-surface appearance. In one highly filled EMC system, carnauba showed poorer surface compatibility than the other waxes tested. That is why SaraWest treats every project as a qualification program.
What your team defines
The useful specification is your specification.
We do not publish invented electronics-grade limits. Each acceptance value is tied to your method, process and package.
Package & process
IC, BGA or other package · lead frame or laminate · transfer or compression molding
Compound system
Resin and cure chemistry · silica or other filler · current release package · use level
Analytical limits
Customer method and limits for extractable ions, ash, residue and other controlled attributes
Qualification
Moldability · fouling · package interfaces · moisture/reflow · downstream cleanliness
Qualification matrix
Evidence before claims.
Numeric acceptance limits remain customer-specified unless documented for the agreed SaraWest batch.
| Review area | What is evaluated | Required evidence |
|---|---|---|
| Material identity | Wax grade, ionic character, target solids, carrier and emulsifier system | Specification + TDS/COA |
| Extractable ionics | Chloride, sodium, potassium and any additional customer-listed ions | Customer method and limits required |
| Thermal behavior | Melt behavior, mass loss, residue and interaction at compounding and molding temperatures | Customer process window + lab evaluation |
| Moldability | Spiral flow, release force, sticking, mold fouling, continuous shots and package appearance | Trial in the complete EMC system |
| Package interfaces | Adhesion and delamination at lead frame, laminate, die paddle, die and passivation interfaces | Package-level qualification |
| Reliability | Moisture/reflow exposure, HAST or other device-specific reliability sequence | Customer qualification plan |
| Downstream cleanliness | Residue or transfer affecting plating, marking, bonding, solderability or other subsequent operations | Customer acceptance method |
Second-source workflow
From incumbent material to controlled evaluation.
01
Share the incumbent
Send the current release material, its TDS/SDS and the specification you need us to review.
02
Define the system
Identify internal or external use, molding process, package family, resin and filler system, and known failure mode.
03
Evaluate a lab batch
We document the agreed formulation and batch properties. The result is an evaluation material, not a qualified device claim.
04
Qualify before scale-up
Your team tests moldability, interfaces, contamination and package reliability in the complete process before production approval.
Published examples establish application context, not a SaraWest product qualification. Ionic limits, composition, analytical methods, process settings and reliability acceptance criteria are customer-specified and confirmed for the agreed formulation and batch.
Technical FAQ
Questions before a trial.
Is an aqueous carnauba emulsion a drop-in replacement for solid wax in EMC?
No. Solid internal wax, an aqueous emulsion evaluated as a formulation input, and an external mold treatment are different material forms and process routes. The carrier, emulsifier package, drying behavior and complete EMC system must be reviewed before testing.
Why are ionic content and residue part of the review?
Semiconductor encapsulation materials are evaluated for contaminants and interfacial cleanliness. The buyer must provide the extraction method, ions of concern and acceptance limits; SaraWest does not infer those limits from a general wax grade.
Does carnauba work in every epoxy molding compound?
No. Published comparative work shows that wax choice can change flow, water absorption, glass-transition behavior and surface appearance. One study found poor carnauba compatibility in its specific highly filled EMC formulation, so every candidate must be tested in the buyer's full system.
What should we send for a second-source review?
Send the current product name and TDS or SDS, its use level and material form, EMC resin and filler description, molding process, package family, required analytical limits, known failure mode, and the qualification methods your team will use.
Technical basis
Published context, clearly separated from product claims.
SOURCE 01 · Tan & Liu, 2011
The effect of wax on the properties of epoxy molding compound
Comparative EMC study covering wax thermal stability, flow, water absorption, modulus, Tg and molded-package surface compatibility.
SOURCE 02 · US Patent 5,567,990 · Hitachi Chemical
Resin-encapsulated semiconductor device
Published semiconductor encapsulant example using epoxy chemistry, high fused-silica loading and a release package that may include carnauba wax.
SOURCE 03 · US Patent 4,042,550 · Allied Chemical
Encapsulant compositions based on anhydride-hardened epoxy resins
Published semiconductor encapsulant composition listing carnauba among possible low-level lubricant/release ingredients.
SOURCE 04 · JEDEC JESD22-A118A
Unbiased Highly Accelerated Temperature and Humidity Stress Test
Industry reliability-test context; passing any package-level test cannot be inferred from a release-agent data sheet.
Confidential technical review
Show us what must be matched.
Attach the incumbent TDS or SDS and tell us how the material is used. Files are private to the SaraWest team.